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atmel-8735b-seeprom-at93c56b-66b-datasheet_042013 features ? low-voltage operation ? v cc = 1.7v to 5.5v ? user-selectable internal organization ? 2k: 256 x 8 or 128 x 16 ? 4k: 512 x 8 or 256 x 16 ? 3-wire serial interface ? sequential read operation ? 2mhz clock rate (5v) ? self-timed write cycle (5ms max) ? high reliability ? endurance: 1,000,000 write cycles ? data retention: 100 years ? 8-lead jedec soic, 8-lead tssop, 8-pad udfn, 8-pad xdfn, and 8-ball vfbga packages description the atmel ? at93c56b/66b provides 2,048/4,096 bits of serial electrically erasable programmable read-only memory (eeprom) organized as 128/256 words of 16 bits each (when the org pin is connected to v cc ) and 256/512 words of 8 bits each (when the org pin is tied to ground). the device is optimized for use in many industrial and commercial applications where low-power and low-voltage operations are essential. the at93c56b/66b is available in space-saving 8-lead jedec soic, 8-lead tssop, 8-pad udfn, 8-pad xdfn, and 8-ball vfbga packages. the at93c56b/66b is enabled through the chip select pin (cs) and accessed via a 3-wire serial interface consisting of data input (di), data output (do), and shift clock (sk). upon receiving a read instruction at di, the address is decoded, and the data is clocked out serially on the do pin. the write cycle is completely self-timed, and no separate erase cycle is required before write. the write cycle is only enabled when the part is in the erase/write enable state. when cs is brought high following the initiation of a write cycle, the do pin outputs the ready/busy status of the part. the at93c56b/66b operates from 1.7v to 5.5v. at93c56b and at93c66b 3-wire serial eeprom 2k (256 x 8 or 128 x 16) and 4k (512 x 8 or 256 x 16) datasheet
2 atmel at93c56b/66b [datasheet] atmel-8735b-seeprom-at93c56b-66b-datasheet_042013 1. pin configurations and pinouts table 1-1. pin configurations 2. absolute maximum ratings* pin name function cs chip select sk serial data clock di serial data input do serial data output gnd ground v cc power supply org internal organization nc no connect v cc nc org gnd cs sk di do 1 2 3 4 8 7 6 5 8-ball vfbga bottom view note: drawings are not to scale. 8-pad udfn/xdfn bottom view v cc nc org gnd cs sk di do 1 2 3 4 8 7 6 5 top view 8-lead tssop 1 2 3 4 8 7 6 5 cs sk di do v cc nc org gnd top view 8-lead soic cs sk di do v cc nc org gnd 1 2 3 4 8 7 6 5 operating temperature ???????????????????????? 55 ? c to +125 ? c storage temperature ???????????????????????????? 65 ? c to +150 ? c voltage on any pin with respect to ground ??????????????????????????????? 1.0v to +7.0v maximum operating voltage . . . . . . . . . . . . . . . 6.25v dc output current. . . . . . . . . . . . . . . . . . . . . . . 5.0ma *notice: stresses beyond those listed under ?absolute maximum ratings? may cause permanent damage to the device. this is a stress rating only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. exposure to absolute maximum rating conditions for extended periods may affect device reliability.
3 atmel at93c56b/66b [datasheet] atmel-8735b-seeprom-at93c56b-66b-datasheet_042013 3. block diagram note: when the org pin is connected to v cc , the x 16 organization is selected. when it is connected to ground, the x 8 organization is selected. if the org pin is left unconnected, and the application does not load the input beyond the capability of the internal 1m ? pull-up resistor, then the x 16 organization is selected. org di cs sk v cc gnd address decoder output buffer data register mode decode logic clock generator do memory array 256/512 x 8 or 128/256 x 16
4 atmel at93c56b/66b [datasheet] atmel-8735b-seeprom-at93c56b-66b-datasheet_042013 4. memory organization 4.1 pin capacitance (1) note: 1. this parameter is characterized, and is not 100% tested. 4.2 dc characteristics note: 1. v il min and v ih max are reference only, and are not tested. applicable over recommended operating range from t a = 25 ? c, f = 1.0mhz, v cc = 5.0v (unless otherwise noted). symbol test conditions max units conditions c out output capacitance (do) 5 pf v out = 0v c in input capacitance (cs, sk, di) 5 pf v in = 0v applicable over recommended operating range from t ai = -40c to +85c, v cc = 1.7v to 5.5v (unless otherwise noted). symbol parameter test condition min typ max unit v cc1 supply voltage 1.7 5.5 v v cc2 supply voltage 2.5 5.5 v v cc3 supply voltage 4.5 5.5 v i cc supply current v cc = 5.0v read at 1.0mhz 0.5 2.0 ma write at 1.0mhz 0.5 2.0 ma i sb1 standby current v cc = 1.7v cs = 0v 0.4 1.0 a i sb2 standby current v cc = 2.5v cs = 0v 6.0 10.0 a i sb3 standby current v cc = 5.0v cs = 0v 10.0 15.0 a i il input leakage v in = 0v to v cc 0.1 3.0 a i ol output leakage v in = 0v to v cc 0.1 3.0 a v il1 (1) input low voltage 2.5v ?? v cc ? 5.5v ? 0.6 0.8 v v ih1 (1) input high voltage 2.5v ?? v cc ? 5.5v 2.0 v cc + 1 v v il2 (1) input low voltage 1.7v ? v cc ? 2.5v ? 0.6 v cc x 0.3 v v ih2 (1) input high voltage 1.7v ? v cc ? 2.5v v cc x 0.7 v cc + 1 v v ol1 output low voltage 2.5v ? v cc ? 5.5v i ol = 2.1ma 0.4 v v oh1 output high voltage 2.5v ? v cc ? 5.5v i oh = ? 0.4ma 2.4 v v ol2 output low voltage 1.7v ? v cc ? 2.5v i ol = 0.15ma 0.2 v v oh2 output high voltage 1.7v ? v cc ? 2.5v i oh = ? 100 a v cc ? 0.2 v
5 atmel at93c56b/66b [datasheet] atmel-8735b-seeprom-at93c56b-66b-datasheet_042013 4.3 ac characteristics note: 1. this parameter is characterized, and is not 100% tested. applicable over recommended operating range from t ai = ? 40c to + 85c, v cc = as specified, cl = 1 ttl gate and 100pf (unless otherwise noted). symbol parameter test condition min max units f sk sk clock frequency 4.5v ? v cc ?? 5.5v 0 2 mhz 2.5v ? v cc ?? 5.5v 0 1 mhz 1.7v ? v cc ?? 5.5v 0 250 khz t skh sk high time 2.5v ? v cc ?? 5.5v 250 ns 1.7v ? v cc ?? 5.5v 1000 ns t skl sk low time 2.5v ? v cc ?? 5.5v 250 ns 1.7v ? v cc ?? 5.5v 1000 ns t cs minimum cs low time 2.5v ? v cc ?? 5.5v 250 ns 1.7v ? v cc ?? 5.5v 1000 ns t css cs setup time relative to sk 2.5v ? v cc ?? 5.5v 50 ns 1.7v ? v cc ?? 5.5v 200 ns t dis di setup time relative to sk 2.5v ? v cc ?? 5.5v 100 ns 1.7v ? v cc ?? 5.5v 400 ns t csh cs hold time relative to sk 0 ns t dih di hold time relative to sk 2.5v ? v cc ?? 5.5v 100 ns 1.7v ? v cc ?? 5.5v 400 ns t pd1 output delay to 1 ac test 2.5v ? v cc ?? 5.5v 250 ns 1.7v ? v cc ?? 5.5v 1000 ns t pd0 output delay to 0 ac test 2.5v ? v cc ?? 5.5v 250 ns 1.7v ? v cc ?? 5.5v 1000 ns t sv cs to status valid ac test 2.5v ? v cc ?? 5.5v 250 ns 1.7v ? v cc ?? 5.5v 1000 ns t df cs to do in high-impedance ac test 2.5v ? v cc ?? 5.5v 150 ns cs = v il 1.7v ? v cc ?? 5.5v 400 ns t wp write cycle time 1.7v ? v cc ?? 5.5v 5 ms endurance (1) 5.0v, 25c 1,000,000 write cycles
6 atmel at93c56b/66b [datasheet] atmel-8735b-seeprom-at93c56b-66b-datasheet_042013 4.4 at93c56b/66b instruction set note: 1. the xs in the address field represent don?t care values, and must be clocked. instruction sb opcode address data comments x 8 (1) x 16 (1) x 8 x 16 read 1 10 a 8 ? a 0 a 7 ? a 0 reads data stored in memory at specified address. ewen 1 00 11xxxxxxx 11xxxxxx write enable must precede all programming modes. erase 1 11 a 8 ? a 0 a 7 ? a 0 erases memory location a n ? a 0 . write 1 01 a 8 ? a 0 a 7 ? a 0 d 7 ? d 0 d 15 ? d 0 writes memory location a n ? a 0 . eral 1 00 10xxxxxxx 10xxxxxx erases all memory locations. valid only at v cc3 ( section 4.2, ?dc characteristics? on page 4 ). wral 1 00 01xxxxxxx 01xxxxxx d 7 ? d 0 d 15 ? d 0 writes all memory locations. valid only at v cc3 ( section 4.2 ) and disable register cleared. ewds 1 00 00xxxxxxx 00xxxxxx disables all programming instructions.
7 atmel at93c56b/66b [datasheet] atmel-8735b-seeprom-at93c56b-66b-datasheet_042013 5. functional description the at93c56b/66b is accessed via a simple and versatile 3-wire serial communication interface. device operation is controlled by seven instructions issued by the host processor. a valid instruction starts with a rising edge of cs and consists of a start bit (logic 1), followed by the appropriate opcode, and the desired memory address location. read: the read instruction contains the address code for the memory location to be read. after the instruction and address are decoded, data from the selected memory location is available at the serial output pin, do. output data changes are synchronized with the rising edges of the serial clock pin, sk. it should be noted that a dummy bit (logic 0) precedes the 8-bit or 16-bit data output string. the at93c56b/66b supports sequential read operations. the device will automatically increment the internal address pointer and clock out the next memory location as long as chip select (cs) is held high. in this case, the dummy bit (logic 0) will not be clocked out between memory locations, thus allowing for a continuous stream of data to be read. erase/write enable (ewen): to ensure data integrity, the part automatically goes into the erase/write disable (ewds) state when power is first applied. an erase/write enable (ewen) instruction must be executed first before any programming instructions can be carried out. note: once in the ewen state, programming remains enabled until an ewds instruction is executed, or v cc power is removed from the part. erase: the erase instruction programs all bits in the specified memory location to the logic 1 state. the self-timed erase cycle starts once the erase instruction and address are decoded. the do pin outputs the ready/busy status of the part if cs is brought high after being kept low for a minimum of t cs . a logic 1 at the do pin indicates that the selected memory location has been erased, and the part is ready for another instruction. write: the write instruction contains the 8-bits or 16-bits of data to be written into the specified memory location. the self-timed programming cycle, t wp , starts after the last bit of data is received at serial data input pin di. the do pin outputs the ready/busy status of the part if cs is brought high after being kept low for a minimum of t cs . a logic 0 at do indicates that programming is still in progress. a logic 1 indicates that the memory location at the specified address has been written with the data pattern contained in the instruction, and the part is ready for further instructions. a ready/busy status cannot be obtained if cs is brought high after the end of the self-timed programming cycle, t wp . erase all (eral): the erase all (eral) instruction programs every bit in the memory array to the logic 1 state and is primarily used for testing purposes. the do pin outputs the ready/busy status of the part if cs is brought high after being kept low for a minimum of t cs . the eral instruction is valid only at v cc3 ( section 4.2, ?dc characteristics? on page 4 ) . write all (wral): the write all (wral) instruction programs all memory locations with the data patterns specified in the instruction. the do pin outputs the ready/busy status of the part if cs is brought high after being kept low for a minimum of t cs . the wral instruction is valid only at v cc3 ( section 4.2 ). erase/write disable (ewds): to protect against accidental data disturbance, the erase/write disable (ewds) instruction disables all programming modes and should be executed after all programming operations. the operation of the read instruction is independent of both the ewen and ewds instructions and can be executed at any time.
8 atmel at93c56b/66b [datasheet] atmel-8735b-seeprom-at93c56b-66b-datasheet_042013 6. timing diagrams figure 6-1. synchronous data timing table 6-1. organization key for timing diagrams notes: 1. a 8 is a don?t-care value, but the extra clock is required. 2. a 7 is a don?t-care value, but the extra clock is required. i/o at93c56b (2k) at93c66b (4k) x 8 x 16 x 8 x 16 a n a 8 (1) a 7 (2) a 8 a 7 d n d 7 d 15 d 7 d 15 cs sk di do (read) do (program) v ih v il v ih v il v ih v il v oh v ol v oh v ol status valid t css t dis t sv t dih t pd0 t skh t skl t pd1 t csh t df t df
9 atmel at93c56b/66b [datasheet] atmel-8735b-seeprom-at93c56b-66b-datasheet_042013 figure 6-2. read timing figure 6-3. ewen timing figure 6-4. ewds timing high-impedance cs sk di do 1 1 0 an a0 0dn d0 t cs 10 011 ... cs sk di t cs 10 000 ... cs sk di t cs
10 atmel at93c56b/66b [datasheet] atmel-8735b-seeprom-at93c56b-66b-datasheet_042013 figure 6-5. write timing figure 6-6. wral timing (1) note: 1. valid only at v cc3 ( section 4.2, ?dc characteristics? on page 4 ). cs sk di t cs t wp 11 an dn 0a0d0 ... ... do high-impedance busy ready cs sk di do high-impedance busy ready 1 0 0 1 ... d n t cs t wp ... d0 0 cs sk di do
11 atmel at93c56b/66b [datasheet] atmel-8735b-seeprom-at93c56b-66b-datasheet_042013 figure 6-7. erase timing figure 6-8. eral timing (1) note: 1. valid only at v cc3 ( section 4.2, ?dc characteristics? on page 4 ) . cs sk di do high-impedance high-impedance 1 1 ... 1an t cs t sv t df t wp an-1 an-2 a0 check status standby ready busy cs sk di do high-impedance high-impedance cs sk di do 11 00 0 ready busy check status standby t wp t cs t sv t df
12 atmel at93c56b/66b [datasheet] atmel-8735b-seeprom-at93c56b-66b-datasheet_042013 7. ordering code detail atmel designator product family device density device revision shipping carrier option package device grade or wafer/die thickness package option 56 = 2k 66 = 4k b or blank = bulk (tubes) t = tape and reel operating voltage m = 1.7v to 5.5v h = green, nipdau lead finish industrial temperature range (-40c to +85c) u = green, matte sn lead finish industrial temperature range (-40c to +85c) 11 = 11mil wafer thickness ss = jedec soic x = tssop ma = udfn me = xdfn c = vfbga wwu = wafer unsawn at93c56b-sshm-b
13 atmel at93c56b/66b [datasheet] atmel-8735b-seeprom-at93c56b-66b-datasheet_042013 8. part markings drawing no. rev. title 93c56-66bsm b 3/22/13 93c56-66bsm , at93c56b and at93c66b package marking information package mark contact: dl-cso-assy_eng@atmel.com aaaaaaaa ###% @ atmlhyww 8-lead soic 8-lead tssop aaaaaaa ###% @ athyww ### yxx 8-pad xdfn 8-pad udfn ### h%@ yxx 2.0 x 3.0 mm body 1.5 x 2.0 mm body 8-ball vfbga pin 1 ###u ymxx 1.8 x 2.2 mm body note 2: package drawings are not to scale note 1: designates pin 1 at93c56b and at93c66b: package marking information catalog number truncation at93c56b truncation code ###: 56b at93c66b truncation code ###: 66b date codes voltages y = year m = month ww = work week of assembly % = minimum voltage 3: 2013 7: 2017 a: january 02: week 2 m: 1.7v min 4: 2014 8: 2018 b: february 04: week 4 5: 2015 9: 2019 ... ... 6: 2016 0: 2020 l: december 52: week 52 country of assembly lot number grade/lead finish material @ = country of assembly aaa...a = atmel wafer lot number u: industrial/matte tin/snagcu h: industrial/nipdau trace code atmel truncation xx = trace code (atmel lot numbers correspond to code) at: atmel example: aa, ab.... yz, zz atm: atmel atml: atmel
14 atmel at93c56b/66b [datasheet] atmel-8735b-seeprom-at93c56b-66b-datasheet_042013 9. ordering information notes: 1. b = bulk 2. t = tape and reel ? soic = 4k per reel ? tssop, udfn, xdfn, and vfbga = 5k per reel 3. for wafer sales, please contact atmel sales. atmel ordering code lead finish package voltage operation range at93c56b-sshm-b (1) nipdau (lead-free/halogen-free) 8s1 1.7v to 5.5v industrial temperature ( ? 40 ? c to 85 ? c) at93c56b-sshm-t (2) at93c56b-xhm-b (1) 8x at93c56b-xhm-t (2) at93c56b-mahm-t (2) 8ma2 at93c56b-mehm-t (2) 8me1 at93c56b-cum-t (2) snagcu (lead-free/halogen-free) 8u3-1 at93c56b-wwu11m (3) ? wafer sale at93c66b-sshm-b (1) nipdau (lead-free/halogen-free) 8s1 1.7v to 5.5v industrial temperature ( ? 40 ? c to 85 ? c) AT93C66B-SSHM-T (2) at93c66b-xhm-b (1) 8x at93c66b-xhm-t (2) at93c66b-mahm-t (2) 8ma2 at93c66b-mehm-t (2) 8me1 at93c66b-cum-t (2) snagcu (lead-free/halogen-free) 8u3-1 at93c66b-wwu11m (3) ? wafer sale package type 8s1 8-lead, 0.150? wide, plastic gull wing, small outline (jedec soic) 8x 8-lead, 0.170? wide, thin shrink small outline (tssop) 8ma2 8-pad, 2.00mm x 3.00mm body, 0.50mm pitch, ultra thin dual no lead (udfn) 8me1 8-pad, 1.80mm x 2.20mm body, extra thin dual no lead (xdfn) 8u3-1 8-ball, 1.50mm x 2.00mm body, 0.50mm pitch, small die ball grid array (vfbga)
15 atmel at93c56b/66b [datasheet] atmel-8735b-seeprom-at93c56b-66b-datasheet_042013 10. packaging information 10.1 8s1 ? 8-lead jedec soic drawing no. rev. title gpc common dimensions (unit of measure = mm) symbol min nom max note a1 0.10 ? 0.25 a 1.35 ? 1.75 b 0.31 ? 0.51 c 0.17 ? 0.25 d 4.80 ? 5.05 e1 3.81 ? 3.99 e 5.79 ? 6.20 e 1.27 bsc l 0.40 ? 1.27 ? ? 0 ? 8 ? e 1 n top view c e1 end view a b l a1 e d side view package drawing contact: packagedrawings@atmel.com 8s1 g 6/22/11 notes: this drawing is for general information only. refer to jedec drawing ms-012, variation aa for proper dimensions, tolerances, datums, etc. 8s1, 8-lead (0.150? wide body), plastic gull wing small outline (jedec soic) swb
16 atmel at93c56b/66b [datasheet] atmel-8735b-seeprom-at93c56b-66b-datasheet_042013 10.2 8x ? 8-lead tssop drawing no. rev. title gpc common dimensions (unit of measure = mm) symbol min nom max note a - - 1.20 a1 0.05 - 0.15 a2 0.80 1.00 1.05 d 2.90 3.00 3.10 2, 5 e 6.40 bsc e1 4.30 4.40 4.50 3, 5 b 0.19 ? 0.30 4 e 0.65 bsc l 0.45 0.60 0.75 l1 1.00 ref c 0.09 - 0.20 side view end view top view a2 a l l1 d 1 e1 n b pin 1 indicator this corner e e notes: 1. this drawing is for general information only. refer to jedec drawing mo-153, variation aa, for proper dimensions, tolerances, datums, etc. 2. dimension d does not include mold flash, protrusions or gate burrs. mold flash, protrusions and gate burrs shall not exceed 0.15mm (0.006in) per side. 3. dimension e1 does not include inter-lead flash or protrusions. inter-lead flash and protrusions shall not exceed 0.25mm (0.010in) per side. 4. dimension b does not include dambar protrusion. allowable dambar protrusion shall be 0.08mm total in excess of the b dimension at maximum material condition. dambar cannot be located on the lower radius of the foot. minimum space between protrusion and adjacent lead is 0.07mm. 5. dimension d and e1 to be determined at datum plane h. package drawing contact: packagedrawings@atmel.com h 8x e 12/8/11 8x, 8-lead 4.4mm body, plastic thin shrink small outline package (tssop) tnr c a1
17 atmel at93c56b/66b [datasheet] atmel-8735b-seeprom-at93c56b-66b-datasheet_042013 10.3 8ma2 ? 8-pad udfn title drawing no. gpc rev. package drawing contact: packagedrawings@atmel.com 8ma2 ynz c 8ma2, 8-pad, 2 x 3 x 0.6 mm body, thermally enhanced plastic ultra thin dual flat no lead package (udfn) common dimensions (unit of measure = mm) symbol min nom max note d 1.90 2.00 2.10 e 2.90 3.00 3.10 d2 1.40 1.50 1.60 e2 1.20 1.30 1.40 a 0.50 0.55 0.60 a1 0.0 0.02 0.05 a2 ? ? 0.55 c 0.152 ref l 0.30 0.35 0.40 e 0.50 bsc b 0.18 0.25 0.30 3 k 0.20 ? ? 9/6/12 d2 e2 e e (6x) l (8x) b (8x) pin#1 id a a1 a2 pin 1 id d c k 8 7 6 5 1 2 3 4 1 2 3 4 8 7 6 5
18 atmel at93c56b/66b [datasheet] atmel-8735b-seeprom-at93c56b-66b-datasheet_042013 10.4 8me1 ? 8-pad xdfn package drawing contact: packagedrawings@atmel.com gpc drawing no. rev. title common dimensions (unit of measure = mm) dtp symbol min nom max note ? 0.00 1.70 2.10 0.15 0.26 a a1 d e b e e1 l ? ? 1.80 2.20 0.20 0.40 typ 1.20 ref 0.30 0.40 0.05 1.90 2.30 0.25 0.35 end view 8me1 b 9/10/2012 8me1 , 8-pad (1.80mm x 2.20mm body) extra thin dfn (xdfn) top view 6 5 7 4 3 e d 8 1 2 pin #1 id 0.10 0.15 b l b e pin #1 id e1 a1 a side view
19 atmel at93c56b/66b [datasheet] atmel-8735b-seeprom-at93c56b-66b-datasheet_042013 10.5 8u3-1 ? 8-ball vfbga drawing no. rev. title gpc package drawing contact: packagedrawings@atmel.com 8u3-1 e 3/27/12 8u3-1, 8-ball, 1.50mm x 2.00mm body, 0.50mm pitch, vfbga package gxu common dimensions (unit of measure - mm) symbol min nom max note a 0.73 0.79 0.85 a1 0.09 0.14 0.19 a2 0.40 0.45 0.50 b 0.20 0.25 0.30 2 d 1.50 bsc e 2.0 bsc e 0.50 bsc e1 0.25 ref d 1.00 bsc d1 0.25 ref 1. this drawing is for general information only. 2. dimension ?b? is measured at maximum solder ball diameter. 3. solder ball composition shall be 95.5sn-4.0ag-.5cu. notes: a2 side view a pin 1 ball pad corner top view e d a1 b 8 solder balls bottom view (d1) d 4 3 2 (e1) 6 e 5 7 pin 1 ball pad corner 1 8 2.
20 atmel at93c56b/66b [datasheet] atmel-8735b-seeprom-at93c56b-66b-datasheet_042013 11. revision history revision no. date comments 8735b 04/2013 correct synchronous data timing figure and remove note. update tssop package option from 8a2 to 8x. update udfn package option from 8y6 to 8ma2. update template and atmel logos. 8735a 01/2011 initial document release.
x x x x atmel corporation 1600 technology drive, san jose, ca 95110 usa t: (+1)(408) 441.0311 f: (+1)(408) 436.4200 | www.atmel.com ? 2013 atmel corporation. all rights reserved. / rev.: atmel-8735b-seeprom-at93c56b-66b-datasheet_042013 disclaimer: the information in this document is provided in connection with atmel products. no license, express or implied, by estoppel or otherwise, to any intellectual property right is granted by this document or in connection with the sale of atmel products. except as set forth in the atmel terms and condit ions of sales located on the atmel website, atmel assumes no liability whatsoever and disclaims any express, implied or statutory warranty relating to its p roducts including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or non-infringement. in no event shall atmel be liable for any direct, indirect, consequential, punitive, special or incidental damages (including, without limi tation, damages for loss and profits, business interruption, or loss of information) arising out of the use or inability to use this document, even if atmel has been advised of the possibility of such damages. atmel makes no representations or warranties with respect to the accuracy or c ompleteness of the contents of this document and reserves the right to make changes to specifications and products descriptions at any time without notice. atmel d oes not make any commitment to update the information contained herein. unless specifically provided otherwise, atmel products are not suitable for, and shall not be used in, automo tive applications. atmel products are not intended, authorized, or warranted for use as components in applications intended to support or sustain life. safety-critical, military, and automotive applications disclaimer: atmel products are not designed for and will not be used in connection with any applications where the failure of such products would reasonably be expected to result in significant personal injury or death (?safety-critical a pplications?) without an atmel officer's specific written consent. safety-critical applications include, without limitation, life support devices and systems, equipment or systems for t he operation of nuclear facilities and weapons systems. atmel products are not designed nor intended for use in military or aerospace applications or environments unless specifically designated by atmel as military-grade. atmel products are not designed nor intended for use in automotive applications unless specifically designated by atmel as automotive-grade. atmel ? , atmel logo and combinations thereof, and others, are registered trademarks or trademarks of atmel corporation or its subsidia ries. other terms and product names may be trademarks of others.

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